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BEI Sensors 652D Series Dual Beam SOP Devices ZIF

BEI Sensors 652D Series Dual Beam SOP Devices ZIF

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Features Open top, Zero Insertion Force design for automatic loading Compact size for high board density Two points of contact
BEI Sensors 656 Series SSOP Devices ZIF

BEI Sensors 656 Series SSOP Devices ZIF

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Features Open top, zero insertion force design for automatic loading Compact size for high board density Highly reliable, pre-loaded contacts
BEI Sensors 656T Series SSOP with Center Pad Connection Devices ZIF

BEI Sensors 656T Series SSOP with Center Pad Connection Devices ZIF

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Features Compact size for maximum board density Wide target area for easy entry and removal of IC leads Dual face-wipe
BEI Sensors 6600 Series 8 Pin Dip Style Subminiature Thermostat

BEI Sensors 6600 Series 8 Pin Dip Style Subminiature Thermostat

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The Airpax® 6600 series is a RoHS compliant, positive snap action, single pole / single throw, a subminiature bimetallic thermostat
BEI Sensors 6700 Series TO-220 Subminiature Thermostat

BEI Sensors 6700 Series TO-220 Subminiature Thermostat

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The Airpax® 6700 series is a RoHS compliant, positive snap action, single pole / single throw, a subminiature bimetallic thermostat
BEI Sensors 676 Series TSSOP Devices  Dual Pinch ZIF

BEI Sensors 676 Series TSSOP Devices  Dual Pinch ZIF

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Features Open top, zero insertion force design for automatic loading Dual pinch, highly reliable contacts Live bug insertion Thru hole
BEI Sensors 678 Series

BEI Sensors 678 Series

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Features “Dual Pinch” highly reliable contacts Separate contacts for interfacing with heat slug Open top, zero insertion force for automatic
BEI Sensors 680 Series QFP Devices Dual Pinch

BEI Sensors 680 Series QFP Devices Dual Pinch

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Features Open top, Zero Insertion Force design for automatic loading Compact outline for maximum board density Highly reliable Dual Beam
BEI Sensors 70CP

BEI Sensors 70CP

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The 70CP series pressure sensors are ideally suited for environmentally demanding OEM industrial applications. This series accommodates a wide range
BEI Sensors 715 Series CSP/BGA/QFN Devices Open Top

BEI Sensors 715 Series CSP/BGA/QFN Devices Open Top

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Features Open top Compression surface mount Spring and probe contact 4 point crown tip interface on DUT solder ball Pointed
BEI Sensors 716 Series QFN/LGA Devices Open Top

BEI Sensors 716 Series QFN/LGA Devices Open Top

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Features Open Top Compression Surface Mount Spring and probe contact Pointed probe contacts DUT pad Pointed probe maintains continuous contact
BEI Sensors 717 Series QFN/LGA Devices Lidded

BEI Sensors 717 Series QFN/LGA Devices Lidded

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Features Clamshell design, compression surface mount Spring and probe contact Pointed probe maintains continuous contact to PCB Spring loaded pressure
BEI Sensors 718 Series CSP/BGA/QFN Devices Lidded

BEI Sensors 718 Series CSP/BGA/QFN Devices Lidded

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Features Clamshell design, compression surface mount Spring and probe contact Pointed probe maintains continuous contact to PCB Spring loaded pressure
BEI Sensors 72X Series CSP/BGA/QFN Devices Lidded

BEI Sensors 72X Series CSP/BGA/QFN Devices Lidded

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Features Handles package sizes 3x3mm to 10x10mm Clam shell Compression Surface Mount Elastomer interface material Wedge guided pressure pad for
BEI Sensors 772 Series CSP/FBGA Devices

BEI Sensors 772 Series CSP/FBGA Devices

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Features 0.4mm pitch for large array Compression surface mount Support up to 34×34 ball matrix Z-axis compliant buckling beam, contact