BEI Sensors 773 Series CSP/FBGA Devices

Features 0.4mm pitch Compression surface mount High performance/low cost achieved through use of carrier loaded stamped contact Z-axis compliant buckle

BEI Sensors 774 Series CSP/FBGA Devices

Features 0.5mm and 0.8mm pitch Compression surface mount High performance/low cost achieved through use of carrier loaded stamped contact Z-axis

BEI Sensors 775 Series CSP/FBGA Devices

Features 0.5mm and 0.8mm pitch Compression surface mount High performance/low cost achieved through use of carrier loaded stamped contact Z-axis

BEI Sensors 775E Series CSP/FBGA Devices

Features 0.8mm Pitch Compression surface mount Z-axis compliant “U” shaped contact supports a wide variety of solder ball shape and

BEI Sensors 776 Series CSP/FBGA Devices

Features 0.5mm and 0.65mm pitch Low cost / high performance achieved through use of carrier loaded stamped contact “U” contact

BEI Sensors 776P Series CSP/BGA/QFN Devices Open Top

Features Smallest Open Top QFN Socket outline in the industry Thru hole design Robust design built for auto-loading Proven contact

BEI Sensors 777 Series CSP Devices

Features Open top chip scale package and fine pitch BGA’s Accommodates pitch sizes of 0.65mm, 0.75mm, and 0.8mm Compact size

BEI Sensors 790 Series QFN Devices

Features 0.4mm, 0.5mm, 0.65mm, and 8mm pitch Low cost design using stamped cantilever contact Staggered, through hole tail design for

BEI Sensors 860 Series CSP/BGA/QFN Devices

Features Versatile, low cost socket base Passive heat sink or Heat Sink/Heater/Sensor Replaceable contact set Heater – foil or cartridge