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BEI Sensors 70CP

BEI Sensors 70CP

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The 70CP series pressure sensors are ideally suited for environmentally demanding OEM industrial applications. This series accommodates a wide range
BEI Sensors 715 Series CSP/BGA/QFN Devices Open Top

BEI Sensors 715 Series CSP/BGA/QFN Devices Open Top

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Features Open top Compression surface mount Spring and probe contact 4 point crown tip interface on DUT solder ball Pointed
BEI Sensors 716 Series QFN/LGA Devices Open Top

BEI Sensors 716 Series QFN/LGA Devices Open Top

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Features Open Top Compression Surface Mount Spring and probe contact Pointed probe contacts DUT pad Pointed probe maintains continuous contact
BEI Sensors 717 Series QFN/LGA Devices Lidded

BEI Sensors 717 Series QFN/LGA Devices Lidded

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Features Clamshell design, compression surface mount Spring and probe contact Pointed probe maintains continuous contact to PCB Spring loaded pressure
BEI Sensors 718 Series CSP/BGA/QFN Devices Lidded

BEI Sensors 718 Series CSP/BGA/QFN Devices Lidded

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Features Clamshell design, compression surface mount Spring and probe contact Pointed probe maintains continuous contact to PCB Spring loaded pressure
BEI Sensors 72X Series CSP/BGA/QFN Devices Lidded

BEI Sensors 72X Series CSP/BGA/QFN Devices Lidded

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Features Handles package sizes 3x3mm to 10x10mm Clam shell Compression Surface Mount Elastomer interface material Wedge guided pressure pad for
BEI Sensors 772 Series CSP/FBGA Devices

BEI Sensors 772 Series CSP/FBGA Devices

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Features 0.4mm pitch for large array Compression surface mount Support up to 34×34 ball matrix Z-axis compliant buckling beam, contact
BEI Sensors 773 Series CSP/FBGA Devices

BEI Sensors 773 Series CSP/FBGA Devices

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Features 0.4mm pitch Compression surface mount High performance/low cost achieved through use of carrier loaded stamped contact Z-axis compliant buckle
BEI Sensors 774 Series CSP/FBGA Devices

BEI Sensors 774 Series CSP/FBGA Devices

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Features 0.5mm and 0.8mm pitch Compression surface mount High performance/low cost achieved through use of carrier loaded stamped contact Z-axis
BEI Sensors 775 Series CSP/FBGA Devices

BEI Sensors 775 Series CSP/FBGA Devices

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Features 0.5mm and 0.8mm pitch Compression surface mount High performance/low cost achieved through use of carrier loaded stamped contact Z-axis
BEI Sensors 775E Series CSP/FBGA Devices

BEI Sensors 775E Series CSP/FBGA Devices

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Features 0.8mm Pitch Compression surface mount Z-axis compliant “U” shaped contact supports a wide variety of solder ball shape and
BEI Sensors 776 Series CSP/FBGA Devices

BEI Sensors 776 Series CSP/FBGA Devices

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Features 0.5mm and 0.65mm pitch Low cost / high performance achieved through use of carrier loaded stamped contact “U” contact
BEI Sensors 776P Series CSP/BGA/QFN Devices Open Top

BEI Sensors 776P Series CSP/BGA/QFN Devices Open Top

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Features Smallest Open Top QFN Socket outline in the industry Thru hole design Robust design built for auto-loading Proven contact
BEI Sensors 777 Series CSP Devices

BEI Sensors 777 Series CSP Devices

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Features Open top chip scale package and fine pitch BGA’s Accommodates pitch sizes of 0.65mm, 0.75mm, and 0.8mm Compact size
BEI Sensors 7895 Hermetic Motor Protector

BEI Sensors 7895 Hermetic Motor Protector

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The basic element in the on-winding motor thermostat is the Klixon® snap-acting disc. The electrical circuit consists of the pin,