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BEI Sensors 717 Series QFN/LGA Devices Lidded

BEI Sensors 717 Series QFN/LGA Devices Lidded

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Features Clamshell design, compression surface mount Spring and probe contact Pointed probe maintains continuous contact to PCB Spring loaded pressure
BEI Sensors 718 Series CSP/BGA/QFN Devices Lidded

BEI Sensors 718 Series CSP/BGA/QFN Devices Lidded

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Features Clamshell design, compression surface mount Spring and probe contact Pointed probe maintains continuous contact to PCB Spring loaded pressure
BEI Sensors 7235/7236 Series Overload Sensor

BEI Sensors 7235/7236 Series Overload Sensor

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KLIXON® 7235 and 7236 overload sensing controls are designed for the remote sensing of overloads in aircraft electrical systems or
BEI Sensors 7270/7271 Series Aircraft Circuit Breaker

BEI Sensors 7270/7271 Series Aircraft Circuit Breaker

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KLIXON® 7270 and 7271 series circuit breakers were designed to utilize less space behind the panel while protecting wire and
BEI Sensors 7274 Series Aircraft Circuit Breaker

BEI Sensors 7274 Series Aircraft Circuit Breaker

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KLIXON® 7274 series are small, lightweight, low amperage devices that are specifically designed to protect aircraft/aerospace cable and components in airborne
BEI Sensors 7277 Series Aircraft Circuit Breaker

BEI Sensors 7277 Series Aircraft Circuit Breaker

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KLIXON® 7277 series is designed for applications that do not require the tighter performance characteristics and approvals of our military
BEI Sensors 72X Series CSP/BGA/QFN Devices Lidded

BEI Sensors 72X Series CSP/BGA/QFN Devices Lidded

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Features Handles package sizes 3x3mm to 10x10mm Clam shell Compression Surface Mount Elastomer interface material Wedge guided pressure pad for
BEI Sensors 772 Series CSP/FBGA Devices

BEI Sensors 772 Series CSP/FBGA Devices

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Features 0.4mm pitch for large array Compression surface mount Support up to 34×34 ball matrix Z-axis compliant buckling beam, contact
BEI Sensors 773 Series CSP/FBGA Devices

BEI Sensors 773 Series CSP/FBGA Devices

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Features 0.4mm pitch Compression surface mount High performance/low cost achieved through use of carrier loaded stamped contact Z-axis compliant buckle
BEI Sensors 774 Series CSP/FBGA Devices

BEI Sensors 774 Series CSP/FBGA Devices

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Features 0.5mm and 0.8mm pitch Compression surface mount High performance/low cost achieved through use of carrier loaded stamped contact Z-axis
BEI Sensors 775 Series CSP/FBGA Devices

BEI Sensors 775 Series CSP/FBGA Devices

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Features 0.5mm and 0.8mm pitch Compression surface mount High performance/low cost achieved through use of carrier loaded stamped contact Z-axis
BEI Sensors 775E Series CSP/FBGA Devices

BEI Sensors 775E Series CSP/FBGA Devices

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Features 0.8mm Pitch Compression surface mount Z-axis compliant “U” shaped contact supports a wide variety of solder ball shape and
BEI Sensors 776 Series CSP/FBGA Devices

BEI Sensors 776 Series CSP/FBGA Devices

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Features 0.5mm and 0.65mm pitch Low cost / high performance achieved through use of carrier loaded stamped contact “U” contact
BEI Sensors 776P Series CSP/BGA/QFN Devices Open Top

BEI Sensors 776P Series CSP/BGA/QFN Devices Open Top

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Features Smallest Open Top QFN Socket outline in the industry Thru hole design Robust design built for auto-loading Proven contact
BEI Sensors 777 Series CSP Devices

BEI Sensors 777 Series CSP Devices

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Features Open top chip scale package and fine pitch BGA’s Accommodates pitch sizes of 0.65mm, 0.75mm, and 0.8mm Compact size